Exilis for Highly Conformal Dielectric Insulation

Low-k Dielectrics for Semiconductor Applications

GVD’s Exilis is a proprietary CVD polymer that exhibits unparalleled conformality and protects in harsh environments.

Exilis was developed in support of DARPA’s heterogeneous integration programs, and may be applied on chip, wafer, or device level. 

Surface agnostic, micron thin and ultra-conformal

Deposited using a contactless chemical vapor deposition (CVD) process and uniquely suited for miniaturized, geometrically complex, and high-density structures with aspect ratio features of over 50:1.

Low-k material with a high dielectric strength

Exhibits superior dielectric properties ideal for ultra-thin insulation, even at high RF and microwave frequencies. 

Enables reliability in moisture-rich environments

A robust, protective film provides environmental protection and survives 1000 hours of temperature-humidity-bias (THB) testing at only hundreds of nanometers.

Thermally and chemically stable

Withstands continuous temperatures of up to 265°C and well-suited to challenging manufacturing conditions.

Exilis Properties

Material Overview

Appearance

Smooth, transparent, and free of blisters, cracking, peeling, or wrinkles

Continuous Operating Temperature Range

-70°C to 265°C

Typical Thickness

300 - 1000 nm
Material Properties

85°C/85 RH THB Test

JESD-22-A101C, 1000 hours
Pass

Vacuum Stability & Outgassing

ASTM E595
Meets the historical TML and CVCM

Dielectric Constant

MDC Mercury Probe @ 1MHz
2.62

Dissipation Factor

MDC Mercury Probe @ 1MHz
<0.001

Dielectric Strength

MDC Mercury Probe @ 1MHz
7200 V/mil

Young’s Modulus

Nanoindentation
<3.4 GPa

Conformality

Misc.
Aspect ratios up to 50:1

Exilis is Ideal For:

3DHI Microsystems

Wafer-Level Packaging (WLP) Technologies

Microelectromechanical Systems (MEMS)

SiP (system-in-package) Technologies

Application Spotlight

Facilitating Advanced Packaging and Heterogeneous Integration

Advancements in electronics design and manufacture, as well as the general trend toward optimization on all fronts – size, weight, power, and cost (also known as SWAP-C) have put a lot of pressure on electronics designers in recent years. These include a push for miniaturization and modularity for devices with increased thermal performance and power...

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Maximizing Droplet Motion for Microfluidics Applications

Electrowetting has emerged as one of the most commonly used techniques for manipulating the movement of small liquid droplets on surfaces, utilized in lab-on-a-chip devices, optics, and displays. It is achieved via electromechanical reduction of a liquid’s contact angle with an applied electric field on a solid surface. An electrowetting material system will typically consist...

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Application Spotlight

Facilitating Advanced Packaging and Heterogeneous Integration

Advancements in electronics design and manufacture, as well as the general trend toward optimization on all fronts – size, weight, power, and cost (also known as SWAP-C) have put a lot of pressure on electronics designers in recent years. These include a push for miniaturization and...

Read More

Maximizing Droplet Motion for Microfluidics Applications

Electrowetting has emerged as one of the most commonly used techniques for manipulating the movement of small liquid droplets on surfaces, utilized in lab-on-a-chip devices, optics, and displays. It is achieved via electromechanical reduction of a liquid’s contact angle with an applied electric field on a...

Read More

GVD Helps You Move Quickly From Evaluation to Production

When you choose GVD for your project, you’ll work directly with our coating specialists for R&D collaboration through to production-scale coating services. Our coating service is scalable to fit your requirements from the evaluation phase through to high volume manufacturing.

Evaluate

Test different coating technologies and processes on a small number of units.

Validate

Coat engineering volumes for in-depth evaluation.

Scale

GVD can quickly scale up and transfer coating operations to customer’s facility via technology licensing.

Exilis FAQs

While we do not have an exhaustive list of chemical compatibility testing on file, the coating is expected to be chemically stable in the presence of a variety of substances, and insoluble in typical solvents due to its densely cross-linked structure. If needed, we are happy to review substances on a case-by-case basis, or provide samples for testing.

The coating is robust and easily withstands regular handling/rubbing. However, because it’s a thin film of 1 um or less, it will get damaged if a sharp object is used repeatedly to scratch the surface.

We do not explicitly check for pinholes batch to batch. Due to the nature of the (CVD) deposition process, pinholes are unlikely. One of the biggest factors that can affect coating performance is surface contamination; therefore, a clean and residue-free surface is critical to the adhesion of the Exilis coating.  

The coating is fully polymerized post-deposition, and does not require any additional steps once the recipe is complete. 

Due to the nature of the CVD process, all critical process parameters are tightly controlled and highly repeatable.  

Yes!
I’d like to discuss how Exilis can help us provide highly conformal electrical insulation in harsh environments